Instrumentti Mattila IM9912
Matthias Meschke
2007
2007
A versatile system for thin film deposition
Thin film deposition
10 kV electron gun, load lock, oxygen inlet for tunnel junction fabrication, system is cryopumped, six targets on a revolver typed platform
Additional features:
- Two angle sample tilting
- automatic sample rotation
- substrate heating with quartz lamp and temperature measurement by pyrometer
- substrate cleaning with argon plasma gun
Evaporated materials Al, Ti, Au, Pd
Wafer size max 4 inch, clamps for small pieces
Typical deposition range 10 nm/min
Working pressure range 10-6 to 10-8 mbar
Substrate temperature 20°C to 250°C
Loading time 10 min
Micronova Nanofabrication Centre - maintenance area of the cleanroom, between F9 and F10. Tietotie 3, 02150 Espoo
Espoo