OPT Sputter, Plasmalab System 400
Victor Ovchinnikov
victor.ovchinnikov(at)tkk.fi +358 9 470 24988
2000
2002
Substrate Size:
100 mm, smaller pieces in special holder. Substrate thickness up to 2 mm.
Allowed Materials:
Solid state materials without particle generation and outgasing.
Forbidden Materials:
Sticky, powder and liquid materials.
Availability and Cost:
Availability Class: F (Use allowed for all researchers with permission.)
Price Category: High
DC sputtering system with four targets. The system has load lock for manual wafer loading. Deposition process is automated.
The system has three 6” magnetrons and one 4” magnetron and one DC source. Sputtering can be done only from one target at the moment. Water cooled substrate holder. Process gases are Ar, and N2. The system has a turbomolecular pump to maintain high vacuum during processing.
| Sputtered materials | Al, Cu, Cr, Pt, W, Ti |
| Batch size | 8 |
| Deposition modes | static (higher growth rate) or rotating (better uniformity) |
| Typical deposition rate (rotating) | 80 nm/min |
| Loading time of 1 wafer | 5 min |