Electron-Beam Ecaporator, IM9912
N/A
Juha Muhonen Ville Maisi juha.muhonen(at)tkk.fi ville.maisi(at)tkk.fi
2008
2008
Substrate Size:
-
Allowed Materials:
To evaporate: Al, Ti, Ag, Au, Pd, Cu, Ge. Everything else, contact main users
Forbidden Materials:
Magnetic materials
Availability and Cost:
Availability Class: F (Use allowed for all researchers with permission.)
Price Category: medium
A versatile system for thin film deposition. Equipped with 10 kV electron-gun, and with six targets on a revolver type platform. The system is cryopumped, it has a load-lock and oxygen inlet for tunnel junction fabrication.
• Sample tilting with half a degree resolution
• Continuous sample rotation
• Substrate heating with quartz lamp and temperature measurement by pyrometer
• Substrate cleaning with argon plasma gun
• Oxygen line for in-situ oxidation
• Sample size: up to 4" wafer
• Working pressure: 10-6 to 10-8 mbar
• Substrate temperature: Room temperature to 250°C
• Deposition rate: 0.1 - 1 nm/s
• Pumping time needed: ~15 min