Ion Implanter, EATON

Organisaatiot: Aalto-yliopiston teknillinen korkeakoulu (TKK)

Ion Implanter, EATON

Victor Ovchinnikov
victor.ovchinnikov(at)tkk.fi      +358 9 470 24988

1992

2002

Substrate Size:

Thickness up to 1 mm.

Allowed Materials:

Semiconductors .

Forbidden Materials:

Sticky, powder and liquid materials.

Availability and Cost:

Availability Class: (Use allowed only for operator.)
Price Category: Special

High-performance ion implantation system for precise doping of semiconductors. The system has load lock for cassette wafer loading. Implantation is automated.

The implanter includes ion source, separation magnet, linear accelerator and the control system. Implantation is done in large vacuum chamber with two cryo pumps and one diffusion pump. Water cooled substrate holder.

Ion energy 20 - 200 keV
Beam current Up to 500 µA
Ions Ar+, B+, P+
Ion dose 1x10^12 - 1x10^16 cm-2
Implantation time (1x1016 cm-2) 30 min

Micronova Nanofabrication Centre – Nanofab F10. Tietotie 3, 02150 Espoo

Espoo

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