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» Capability Classification
Other Etching
1. Nanofabrication
1.4. Etching
1.4.1. Reactive Ion Etching (RIE, DRIE)
1.4.2. Plasma Etching
1.4.3. Ion Beam Milling and Electron Beam Assisted Etching
1.4.4. Wet Etching
1.4.5. Laser Ablation
1.4.6. Electrochemical Etching
1.4.7. Other Etching
Instruments
Inductively coupled plasma etcher ICP - Tampere University of Technology
2. Characterization
3. Computation, Modeling and Simulation
4. Other
MIKTECH OY - Graanintie 5, 50190 Mikkeli FINLAND
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