Name and Model: F&K Delvotec 5432
Contact Person: Antti Nuottajärvi nuanka@jyu.fi
Year of Manufacture: 2007
Year of Installation: 2007
General Technical Information: Ultrasonic wedge wire bonder
Desrcription of Use: For electrical connections from sample chips to carriers
Key Features and Accessories:
Manual, semiautomatic and automatic modes, stitching mode.
45 deg and 60 deg wire feed
20 um Al and Au wires
Sample vacuum clamping
Leica MZ6 microscope
Key Specifications:
Photograph:
Location: University of Jyväskylä, Nanoscience Center Survontie 9, 40500 Jyväskylä
City: Jyväskylä
Additional information:
Booking:
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