Wire bonder

Organization: University of Jyväskylä » Nanoscience Center

Kulicke & Soffa 4523A

Antti Nuottajärvi
nuanka@jyu.fi

1998

1998

Ultrasonic wedge wire bonder

For electrical connections from sample chips to carriers

Deep access

Manual and semiautomatic mode, stitch mode.

20 um Al and Au wires

Heated specimen holder

Leica MZ6 microscope

University of Jyväskylä, Nanoscience Center
Survontie 9, 40500 Jyväskylä

Jyväskylä

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