Name and Model: Axic Benchmark RFX-600 PC-1500
Contact Person: Antti Nuottajärvi nuanka@jyu.fi
Year of Manufacture: 1996
Year of Installation: 1996
General Technical Information: RF plasma dry etcher
Desrcription of Use: Used for "quick and dirty" dry etch processes on Silicon, SiN and metals. Oxygen plasma cleaning processes.
Key Features and Accessories:
600W RF source, Axic PC-5100 plasma process controller, turbo pumped process chamber, gases: SF6, CF4, O2, Ar. Electrode diameter 180mm.
Key Specifications:
Photograph:
Location: University of Jyväskylä, Nanoscience Center, Cleanroom Survontie 9, 40500 Jyväskylä
City: Jyväskylä
Additional information:
Booking:
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