RIE

Name and Model: Advanced Vacuum Vision 320 Mk II

Contact Person: Tomi Ryynänen

Year of Manufacture: 2007

Year of Installation: 2008

General Technical Information: Reactive ion etcher (RIE).

Desrcription of Use: Isotropic and directional dry etching (Si, SiO2, Si3N4, glass, polymers, metals (limited performance) etc.) and oxygen plasma cleaning.

Key Features and Accessories: Windows based user interface, open load chamber, fluorine chemistry, additional viewport for installing end point detector.

Key Specifications: Electrode plate diameter: 280-305 mm
Max substrate diameter: 10”-12”
Gases: CF4, CHF3, SF6, O2, Ar
RF supply: 600 W, 13.56 MHz
Temperature controlled lower electrode: +5 - +45 deg C
Process chamber material: Aluminium
Wafer platen material: Ceramic

Photograph:

Location: Tampere University of Technology, Sähkötalo building, ASE cleanroom, Se209a.

City: Tampere