Spin Coater

Organization: University of Oulu » Center of Microscopy and Nanotechnology

Suss MicroTec RC8

Hannu Moilanen

2001

2006

Semi-automatic spin coater with hot plate

Device is used for photoresist spin-coating

Spinner: Uses the GYRSET closed cover spin coating system that offers uniform coatings with reduced consumption and less edge buildup.  Handles up to 8 inch round or 6 inch square substrates. Multi-size configuration with automatic GYRSET cover size detection and automatic maximum spin speed limitation set up. Stainless steel cabinet. Pneumatic Dispenser Arm. Edge bead remover. Nitrogen blow. Adapter for small substrates.

Hot plate: Motorized pin lift with programmable speed and extension. Pin lock for height control. Programmable time range. Dual display for set and actual temperatures.

SPINNER
Maximum substrate size:
up to 8” wafer or 6”x6” substrate
Maximum speed:
RC8 GYRSET 8 3000 rpm, RC8 standard plate 7000 rpm
Maximum acceleration:
 5 000 rpm/s
Time range:
0 - 999 s
Speed regulation:
Tachometric
Speed control:
Galvanometric

HOT PLATE
Substrate size:
up to 8” wafer or 6”x6” substrate with pin lift from 4” wafer
Temperature range:
 from room temperature to 400°C
Resolution:
 ± 1°C
Uniformity:
 ± 1°C

University of Oulu, Center of Microscopy and Nanotechnology, Cleanroom

Oulu

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