Name and Model: Oxford Plasmalab System 400
Contact Person: Victor Ovchinnikov
Year of Manufacture: 2000
Year of Installation: 2001 (old), 2002 (new)
General Technical Information: Parallel plate vacuum system
Desrcription of Use: DC magnetron sputter deposition processing
Key Features and Accessories: Load lock for manual wafer loading
Key Specifications:
Sputtered materials (only one at the moment) Al, Cu, Cr, Pt, W (option)
Wafer size 100 mm, smaller pieces in special holder
Wafer number in batch 8
Deposition modes Static (higher growth rate), dynamic (better uniformity)
Typical deposition rate (dynamic) 80 nm/min
Substrate temperature 20 °C, 80 - 350 °C
Loading time of 1 wafer 5 min
Photograph:
Location: Micronova Nanofabrication Centre - cleanroom section F10. Tietotie 3, 02150 Espoo
City: Espoo
Additional information:
Booking: http://www.micronova.fi/booking
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