Name and Model: TPT HB 05
Contact Person: Mikko Laasanen +358 44 785 5591
Year of Manufacture: 2006
Year of Installation: 2006
General Technical Information: Wirebonder for ball and wedge bonding.
Desrcription of Use: Wirebonder is used for making interconnections between a microsensor and measurement electronics. We are using mainly ball bonding with gold wire (25 micron).
Key Features and Accessories:
Ball, wedge and bump bonding. Deep access bond head (16 mm). Video image to PC.
Separate manual bond pull tester (non-destructive type).
Key Specifications:
Bond time: 20-5000 msec.
Bond force: 15-100 cNm.
Photograph:
Location: Savonia University of Applied Sciences, School of Engineering and Technology, Microkatu 1C, FI-70201 Kuopio, Finland
City: Kuopio
Additional information: Available only as a service for short term use. With long term needs call the contact person for more information.
Booking: In case of "as a service", please, call contact person.
Are you sure you want to delete this instrument?
