FEI Helios DualBeam
Hannu Moilanen
2008
2008
The FEI Helios DualBeam is a focused ion beam (FIB) system for nanoscale component fabrication, high-resolution imaging, and sample analysis
The FEI Helios FIB is used in nanoscale fabrication of components, imaging, and analysis of samples. It can also be used in sample preparation for other analysis equipment. FIB can be used in the research of various fields of science like materials research, microelectronics, biosciences, and medicine.
Fabrication of nanostructures
FIB processing is based on the Ga+ ion beam, which is scanned across the surface of the sample placed in the vacuum chamber. The accuracy of FIB machining is a few nanometers and almost all materials can be processed, including diamond and organic compounds. To increase the etching rate, small amounts of various process gasses can be introduced into the vacuum chamber. Ion beam can be used also in selective deposition of thin films and in exposing photoresists and in gray scale lithography.
Analysis and preparation of samples
FIB can be used in structural analysis and imaging of samples. Imaging can be done by using the ion beam, but usually the electron microscope of the device is used. The electron imaging can be conducted in FESEM (Field Emission Scanning Electron Microscope) and STEM (Scanning Transmission Electron Microscope) modes. For analysis of the chemical composition, the system has EDS (Energy-Dispersive X-ray Spectroscopy)-analyzer installed.
Ion beam milling can be used for preparation of the samples for transmission electron microscope (TEM). By using the FIB, thin samples (less than 100 nm) can be produced from the materials which cannot be processed by traditional etching methods. Also the area under investigation can be chosen more accurately than in the other sample preparation methods. FIB has Omniprobe™ nanomanipulator which enables handling of the TEM samples inside the vacuum chamber.
FIB can be used also in tomography which makes it possible to produce 3D images showing the internal structure of the samples under investigation. This method has been successfully used in structural analysis of thin films, cells, bones, and other biological tissues.
FIB system has been used for example in the following research:
- fabrication optical nanocomponents (for example waveguides and quantum dots)
- nanotechnology
- gray scale lithography
- modification of ICs
- structural analysis of steel samples
- structural analysis of thin films
- structural analysis of multilayer thin film structures
- structural analysis of semiconductor components
- 3D imaging of biomedical samples
The FEI Helios FIB is equipped with FESEM (Field Emission Scanning Electron Microscope) and STEM (Scanning Transmission Electron Microscope). For analysis of the chemical composition the system has EDS (Energy-Dispersive X-ray Spectroscopy)-analyzer. System also has a gas delivery system for process gases and Omniprobe™ nanomanipulator which enables the moving of samples inside the vacuum chamber.
FESEM and STEM imaging of samples
Imaging resolution: 1 nm (FESEM/STEM), 100 nm (Ion Beam)
3D structural imaging
Machining resolution: few nanometers depending on material
Deposition of platinum, tungsten, and silicon dioxide
Etching gasses for metals, insulators, and semiconductors
Gray scale lithography
TEM sample preparation
Omniprobe™ nanomanipulator for sample moving inside the vacuum chamber
EDS detector
Elemental analysis from beryllium to uranium