Instrumentti Mattila E-Beam Evaporator
Jukka Viheriälä
2004
2004
Electron-beam metal evaporator.
Evaporation of thin metal layers for electrical contacts and etch masks.
Telemark e-beam source, Cryopump for HV and fast pumping, Cold cathode pressure monitor, accurate thickness monitoring during evaporation with a quartz crystal, water-cooled chamber, adjustable e-beam shape, 8 crucible slots for materials, port valve for separating the vacuum chamber during sample loading, highly anisotropic layer growth, tilting of the sample to any angle during the growth.
E-beam voltage: 4kV to 10 kV
Emission current: Up to 1 Amp @ 10 kV
Chamber pressure: In the range of 10-7 mBar
Evaporated materials: Ag, Al, Au, Cr, Ge, Ni, Pt, Ti (Possibility for other materials must be evaluated case by case)
Growth rate: Typically 0,1 – 2,0 nm/s
Layer thickness : Normally between 5-500 nm
Typical sample size: Below 76 mm in diameter
Tampere University of Technology, Optoelectronics Research Centre (ORC), Cleanroom SK215B, Korkeakoulunkatu 3, 33720 Tampere
Tampere