UV-Mask aligner with NIL support

Name and Model: EVG 620

Contact Person: Jukka Viheriälä

Year of Manufacture: 2004

Year of Installation: 2004

General Technical Information: Ultraviolet lithography tool for photolithography and nanoimprint lithography.

Desrcription of Use: Micro- or nanopatterning UV resists.

Key Features and Accessories: Supports substrate sizes up to 100mm, soft-, hard- and vacuum contact and proximity exposure, wedge error compensation system, top and bottom side alignment, special tooling for ultraviolet nanoimprint lithography, supports soft and hard stamps.

Key Specifications: Wafer / substrate
Size:  up to 100 x 100 mm (Currently max 3” wafer)
Thickness:  0.1 – 10 mm
Mask size:   max 7” (Currently max 4”)
UV-NIL stamp and substrate size: up to 3”
Alignment
 Range of alignment: x, y, z: +- 5 mm
 Rotation:   Theta +- 3 degrees
 Accuracy:  0.5 µm (top side), 1 µm (bottom side)
UV lamp:   7 mW/cm2, i-line
 

Photograph:

Location: Tampere University of Technology, Optoelectronics Research Centre, Cleanroom, Korkeakoulunkatu 3, 33720 Tampere

City: Tampere